No.

Project

Ability

1

Number of PCB layers

1-12层

2

Minimum wire diameter/line spacing (H/H OZ)

3 mil (0076 mm)

3

Minimum wire diameter/line spacing (1/1 OZ)

3 mil (0.076mm)

4

Minimum finished hole

4 mil (0.1 mm)

5

Layer and layer alignment

±3 mil (±0.076 mm)

6

Minimal anti-welding bridge

3 mil (0.076 mm)

7

Shape accuracy

+/-4 mil (±0.1 mm)

8

Aspect ratio

10:1

9

Minimum plate thickness, maximum plate thickness

8 mil (0.2 mm) 120mil（3.0mm）

10

Surface treatment

Lead-free spray tin, gold sink, tin, OSP, silver